SiC wafer thickness measurement device (TME-05 type)
This is a device for measuring the thickness of SiC wafers adhered to a glass plate and the thickness of the adhesive, as well as measuring the thickness of individual SiC wafers.
- The thickness is measured non-contact using an optical probe/sensor. - A porous chuck-type wafer stage is used to uniformly hold thin wafers. - Measurement data is saved in CSV format, in addition to being displayed on the monitor of the accompanying computer. Graphical display is also possible.
- Company：ジャステム
- Price：Other
